Fully Automatic Ultrasonic Cleaning System for Semiconductor Wafers

JTM-10720AD 10-tank fully automatic ultrasonic cleaning system is specially designed for semiconductor wafer cleaning. Adopting 40KHz ultrasonic frequency, the equipment supports adjustable temperature ranging from ambient temperature to 100℃ to adapt to various wafer materials and contaminants. With stable and uniform ultrasonic cavitation, it efficiently removes organic residues, micro-particles, metal ion impurities and processing attachments on wafer surfaces, avoiding surface scratches, particle re-adhesion and cross-contamination. Equipped with an automatic 10-station gantry transmission structure, it has overall dimensions of 12M2M2.6M, total power of 100KW and net weight of 5000kg. Constructed with high-cleanliness anti-corrosion materials and equipped with precision circulating filtration as well as constant temperature control system, the machine delivers stable operation and high cleanliness standard. It is widely applied to wet precision cleaning of silicon wafers, silicon carbide wafers, sapphire substrates and other semiconductor materials, meeting strict ultra-high cleanliness requirements for etching, coating, packaging and other front-end semiconductor processes.