Seven delivered systems supporting semiconductor manufacturing: wafer cleaning machines, valve body electropolishing and passivation lines, spray-and-dry systems for components that cannot be immersed, and explosion-proof machines for flammable solvent chemistry.
The requirements here are set by numbers rather than appearance — particle counts, surface conditions for gas-system components, and water quality specified by conductivity. That changes what the equipment has to do: ultrapure water for rinsing, controlled frequency to remove sub-micron particles without damaging surfaces, cassette handling that transfers wafers without breakage, and materials chosen for the chemistry rather than for cost.
Explosion-proof construction appears in this category because some of these processes use flammable solvents, and the safety case has to be built into the machine rather than added around it. Where your process has a written cleanliness class or a surface specification, that document is the correct starting point for the design.