Fully Automatic Environment-friendly Ultrasonic Cleaning Machine for Wafer & Silicon Chip

JTW-90360AD 9-tank fully automatic eco-friendly ultrasonic cleaning machine is specially developed for wet precision cleaning of wafers and silicon chips in the semiconductor industry. Equipped with a 40KHz-80KHz dual-frequency ultrasonic system, it integrates ultrasonic rotary cleaning, oscillation cleaning and hot air drying processes, with adjustable temperature ranging from ambient temperature to 100℃. Combined rotary and oscillating movements strengthen liquid disturbance. Together with stable ultrasonic cavitation, the machine efficiently removes photoresist residues, micro-particles, organic contaminants and metallic impurities from wafer surfaces, greatly reducing particle re-adhesion and preventing substrate scratches, watermarks and other defects. Featuring a 9-station automatic gantry handling structure, overall dimensions of 9.5M1.8M2.7M, total power of 180KW and net weight of 5000kg, the unit is fitted with closed-loop chemical filtration and centralized waste gas & liquid treatment systems to realize environmental-friendly production and reduce chemical consumption. With high-level clean protection design, it is widely applied in mass cleaning of silicon wafers, silicon carbide chips, sapphire substrates and other semiconductor materials, meeting ultra-high cleanliness standards required by etching, coating, packaging and other front-end semiconductor processes.