This series of 950KHz megasonic cleaning transducers is specially developed for precision cleaning processes of semiconductor wafers, compatible with mainstream wafer specifications including 6-inch, 8-inch (dual 6-inch) and 12-inch (300mm), with maximum power of 1200W, 2400W and 4800W respectively. The high-frequency 950KHz megasonic generates tiny cavitation bubbles with gentle and uniform impact force, which can efficiently remove micro-particles, organic contaminants and photoresist residues on wafer surfaces without causing micro-damage to precision wafers. Featuring standardized design of vibration radiation area and overall dimension, the three models adopt compact structure with excellent sealing performance and uniform stable sound field distribution during operation. They can be integrated into automatic wafer cleaning equipment, widely applied in semiconductor wet cleaning, integrated circuits, photovoltaic chips and other high-end manufacturing fields, effectively improving wafer yield and meeting industrial requirements of high precision and ultra-high cleanliness.