3-Tank Spray & Drying System

JTM-30120AD 3-tank spray and drying system is equipped with 28KHZ-40KHZ wide-frequency ultrasonic system to meet precision cleaning requirements of fixtures made of different materials, with adjustable temperature ranging from ambient temperature to 100℃. Customized for semiconductor wafer carriers, photolithography fixtures and precision tooling jigs, the machine integrates high-pressure spray cleaning and hot air drying processes. Combined with ultrasonic technology and all-round spray flushing, it efficiently removes photoresist residues, silicon powder particles, organic grease and various process attachments, thoroughly cleaning contaminants hidden in gaps and grooves. Circulating hot air drying eliminates watermark residue and avoids secondary particle contamination to wafers. Adopting automatic 3-station gantry transport structure, the equipment has overall dimensions of 4.3M2.5M2.7M, total power of 65KW and net weight of 3000kg. Constructed with high-cleanliness and corrosion-resistant materials, it is equipped with precision circulating filtration as well as waste gas and liquid collection devices, realizing stable mass cyclic cleaning of wafer tooling fixtures and satisfying strict high-cleanliness process standards in semiconductor manufacturing.