Semiconductor Wafer Cleaning Machine

JTM-100504AD 10-tank fully automatic semiconductor wafer cleaning machine is developed for the high-precision cleaning process of semiconductor wafers. Equipped with a 40kHz–80kHz dual-frequency ultrasonic system, it integrates ultrasonic alkaline cleaning, ultrasonic acid cleaning and multi-stage DI water rinsing processes with a maximum cleaning temperature of 60℃. It efficiently strips photoresist residues, particulate contaminants, metallic impurities, organic grease and inorganic oxides from wafer surfaces, preventing micro-damage, particle re-adhesion and cross-contamination to guarantee ultra-high surface cleanliness and flatness. Featuring a 10-station tank layout with automatic gantry transport, overall dimensions of 12M2M2.8M, total power of 120KW and net weight of 5000kg, the machine adopts anti-corrosion, hermetically sealed structure with precise temperature control and high-efficiency circulating filtration. It is suitable for wet cleaning of silicon wafers, SiC wafers, sapphire wafers and other semiconductor substrates, meeting strict cleanliness specifications of front-end semiconductor processes and providing reliable pretreatment for coating, etching, bonding and other core manufacturing procedures.